Substrate developed by Fuwwa!

Chip substrate developed by FUWWA, three-layer asymmetric substrate, blind hole filling, 30μm line width and line spacing

IC substrate is a technology developed with the continuous progress of semiconductor packaging technology. In the mid-1990s, a new type of high-density IC packaging form represented by ball grid array packaging and chip size packaging came out. A new packaging carrier came into being.

IC substrate is developed on the basis of HDI board. As a high-end PCB board, it has the characteristics of high density, high precision, miniaturization and thinness.

IC substrates are also called packaging substrates. In the high-end packaging field, IC substrates have replaced traditional lead frames and become an indispensable part of chip packaging. They not only provide support, heat dissipation and protection for the chip, but also provide support for the chip and PCB motherboard. Provides electronic connections between them, which plays a role of "linking up and down"; even passive and active devices can be embedded to achieve certain system functions.